| Low
Temperature-cured Polyimide Coating Resins
------Low temperature-cured polyimide
coating resins could be completely cured at temperature as low
as 140-200℃ to give polyimide coatings with the identical
performance compared with standard polyimide coating resins which
need to be cured at temperature of higher than 250-300℃.
which is high than the Sn/Pb eutectic solder temperatures (210-260℃).
It was reported that the high curing temperature could usually
cause the quality deterioration of the plastics packaged devices
in which Sn/Pb eutectic solder paste was employed. Hence, low
temperature-cured polyimide coating resins are definitely beneficial
for the electronic packaging.
------The three series of low temperature-cured
polyimide coating resins commercially available, ZKPI-310I/II
with maximum curing temperature of 180-200℃;ZKPI-320I/II
with maximum curing temperature of 160-180℃;ZKPI-330I/II
with maximum curing temperature of 140-160℃;are single
component resins dissolved in harmless and environmental-friendly
organic solvents. The polyimide coating resins, with solid content
and viscosity adjustable upon custom's requiring are stable longer
than 2 months at room temperature and 6 years at 4℃.
Advantages Features:
1.Low curing temperature(140-200℃).
2. Easy handling and processing
3. High purity, low impurity and metal ions, Na+
< 2 ppm, K+ < 2 ppm
4. Excellent thermal stability and thermo-oxidative stability
5. Excellent electric insulating and low dielectric constont
and dissipation factor
6. Good adhesion with various substrates,such as Si,Cu,Al,Au,Ni,SiO2,Si3N4,Al2O3
7. Low moisture absorption
8. Low stress
9. Effective a-particle
barrier
10.Better planarization than inorganic dielectrics such as SiO2 and Si3N4
Typical Applications:
Suitable for applications where high curring temperature(>200-220℃)should
be avoided.
1. Primary and secondary passivation layers
2. Stress buffer coatings and protection layers
3. a-particle
barriers
4. Interlayer dielectrics of multilayer structure , MCM-D ,TQFP,BGA
and CSP.
5. Junction protection coating
6. Liquid crystal aligning layers for LCD (TN, STN, TFT ···
)
Table 1 Physical Properties of Low Temperature-cured
Polyimide Coating Resins1
| |
ZKPI-310II |
ZKPI-320II |
ZKPI-330II |
| Appearance |
Viscous Liquid |
Viscous Liquid |
Viscous Liquid |
| Solid Content2 |
15-16% |
15-16% |
15-16% |
| Solvents |
Organic Mixture |
Organic Mixture |
Organic Mixture |
| Absolute Viscosity2,
(mPa·s, 25 ℃) |
3000-3500 |
3500-4000 |
4000-4500 |
| Gravity, 25 ℃ |
1.01-1.04 |
1.01-1.04 |
1.01-1.04 |
| Maximum CuringTemperature |
200-210 ℃ |
170-180 ℃ |
140-160 ℃ |
Storage Stability
25 ℃
0-4 ℃ |
> 6 weeks
> 12 months |
> 6 weeks
> 3 months |
> 6 weeks
> 12 months |
| Moisture uptake, % |
< 0.01% |
< 0.01% |
< 0.01% |
Impurity
Na+
K+
Fe++
Cl- |
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm |
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm |
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm |
1) The table just lists the representative products, please contact
with us for more detail information
2) The solid content and absolutely viscosity could be adjusted
upon custom's specific requirements
Table 2 Property of the Cured PI Coating
Films
| Properties\Products |
ZKPI-310 |
ZKPI-320 |
ZKPI-330 |
| Mechanical Property |
|
|
|
Tensile strength, MPa
Elongation, %
Density, g/cm3
Moisture uptakes, % |
100-120
8-15
1.10-1.12
<1.0 |
100-120
8-15
1.10-1.12
<1.0 |
100-120
8-15
1.10-1.12
<1.0 |
| Thermal Property |
|
|
|
Tg , ℃
Tin, ℃
T5, ℃
T10, ℃
CTE, ×10 -6/ ℃ |
300-310
>500
>510
>530
35-40 |
243
>500
>510
>530
35-40 |
243
>500
>510
>530
35-40 |
| Electric Property |
|
|
|
Dielectric Constant1 MHz; 0-50% RH
Dissipation Factor1 MHz; 0-50% RH
Dielectric strength, V/µm
Volume resistivity, W×cm
Surface resistivity,W |
3.0-3.2
2-6 x 10-3
200-350
>1016
>1015 |
3.0-3.2
2-6 x 10-3
200-350
>1016
>1015 |
3.0-3.2
2-6 x 10-3
200-350
>1016
>1015 |
|
|
