| Standard
Polyimide Coating Resins
------ZKPI series standard polyimide
coating resins are high purity polyimide precursors- polyamic
acid solutions which could be easily transformed thermally to
polyimide coating films with outstanding thermal, mechanical,
electrical insulating, dielectric characteristics and good adhesion
to Si, Al, Cu, Glass or Ceramics etc.. These products, designed
for the sealing, preserving and protection of semiconductor chip
surface and junction against moisture penetration and other contamination,
are chemically compatible with most device surfaces, providing
physical and environmental protection for chip and interconnecting
wires. The typical applications include: 1) stress relief-buffer
coatings for delicate device die and leads; 2) primary and sencondary
passivation layers of chips; 3) a-particle
barrier for obstruction of a-particle penetration and stabilization
of device characteristics; 4) interlayer dielectrics for multilayer
structures and MCM-D multilayer substrates; and 5) Advanced LCD
alignment coatings etc..
Advantageous Features
1. Easy processing characteristics
2. High purity, Na+ < 2 ppm; K+
< 2 ppm
3. Excellent thermal and thermo-oxidative stability
4. Excellent electrical and dielectric properties
5. Good adhesion to common electronic devices and circuit substrates
with superior moisture resistance and other atmosphere contaminates
6. Low stress to the chip and bonding wires
7. Shields against a-
particle radiation and being free of a-particle
generator
8. Excellent chemical stability. Resistant to the attack of
almost of
organic solvents
9. Better planarization than inorganic dielectrics such as SiO2
and Si3N4
Typical Applications
1. Primary and Secondary Passivation Layers
2. Stress Buffer Coatings and Protection Layers
3. a-
Particle Barriers and Junction Protection
4. Interlayer Dielectrics of Multilayer Structure and of MCM-D,
BGA, CSP···
5. Advanced LCD Alignment Coatings
Processing Procedures
The processing procedure of ZKPI polyimide coating resins includes
only two steps if photopatterns were not required:
1) Applying coating resins on the device surface required;
and then
2) Thermally curing in oven at temperature from 80℃
to 250-300℃ for several hours.
Note: Applying coating resins on device surface could be accomplished
by various methods such as dipping, dispersing and so on. Thermally
curing should be done in air circulating oven which was exhausted
to the outside, preventing exhaust gases from re-circulating into
the semiconductor production process area.
Table 1 ZKPI-305 Series of PI Coating Resins1
| |
ZKPI-305I |
ZKPI-305IIA |
ZKPI-305IID |
ZKPI-305IIG |
| Appearence |
Viscous liquid |
Viscous liquid |
Viscous liquid |
Viscous liquid |
| Solid content2 |
9-10% |
12-13% |
15-16% |
15-16% |
| Solvents |
NMP/DMAc |
NMP/DMAc |
NMP/DMAc |
NMP/DMAc |
| Absolute viscosity2 , mPa·s
at 25 ℃ |
300-400 |
300-400 |
1100-1200 |
14000-15000 |
| Gravity at 25 ℃ |
1.08-1.09 |
1.10-1.12 |
1.10-1.15 |
1.10-1.20 |
| PH Value |
4-5 |
4-5 |
4-5 |
4-5 |
| Maximum Curing Temperature |
220-250 ℃ |
220-250 ℃ |
220-275 ℃ |
220-300 ℃ |
Storage: 25 ℃
------------0-4 ℃ |
> 2 weeks
> 6 months |
> 2 weeks
> 6 months |
> 2 weeks
> 6 months |
> 2 weeks
> 6 months |
| Moisture uptake, % |
< 0.01% |
< 0.01% |
< 0.01% |
< 0.01% |
Impurity:
Na+
K+
Fe++
Cl- |
< 2.0 ppm
< 2.0 ppm
< 2.0 ppm
< 3.0 ppm |
< 2.0 ppm
< 2.0 ppm
< 2.0 ppm
< 3.0 ppm |
< 2.0 ppm
< 2.0 ppm
< 2.0 ppm
< 3.0 ppm |
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm |
1) The table just lists the representative products, please contact
with us for more detail information
2) The solid content and absolutely viscosity could be adjusted
upon custom's specific requirements
Table 2 ZKPI Series of PI Coating Resins1
| |
ZKPI-306II |
ZKPI-307II |
ZKPI-308II |
ZKPI-309II |
| Appearence |
Viscous liquid |
Viscous liquid |
Viscous liquid |
Viscous liquid |
| Solid content2 |
15-16% |
15-16% |
15-16% |
15-16% |
| Solvents |
NMP/DMAc |
NMP/DMAc |
NMP/DMAc |
NMP/DMAc |
| Absolute viscosity2 , mPa·s
at 25 ℃ |
4000-5000 |
5000-6000 |
6000-8000 |
10000-12000 |
| Gravity at 25 ℃ |
1.10-1.12 |
1.10-1.15 |
1.10-1.20 |
1.10-1.20 |
| PH Value |
4-5 |
4-5 |
4-5 |
4-5 |
| Maximum Curing Temperature |
220-275 ℃ |
220-275 ℃ |
220-300 ℃ |
220-300 ℃ |
Storage: 25 ℃
0-4 ℃ |
> 2 weeks
> 6 months |
> 2 weeks
> 6 months |
> 2 weeks
> 6 months |
> 2 weeks
> 6 months |
| Moisture uptake, % |
< 0.01% |
< 0.01% |
< 0.01% |
< 0.01% |
Impurity:
Na+
K+
Fe++
Cl- |
< 2.0 ppm
< 2.0 ppm
< 2.0 ppm
< 3.0 ppm |
< 2.0 ppm
< 2.0 ppm
< 2.0 ppm
< 3.0 ppm |
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm |
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm
< 1.0 ppm |
1) The table just lists the representative products, please
contact with us for more detail information
2) The solid content and absolutely viscosity could be adjusted
upon custom's specific requirements
Table 3 Properties of the Cured Polyimide Coating Films
| Property\Product |
ZKPI-305 |
ZKPI-306 |
ZKPI-307 |
ZKPI-308 |
ZKPI-309 |
| Mechanical Properties |
|
|
|
|
|
Tensile strength, MPa
Elongation, %
Density, g/cm3
Moisture uptake, wt%
Stress, MPa |
100-120
10-20
1.45
1.2-1.5
30-35 |
120-130
10-20
1.45
1.2-1.5
28-32 |
100-120
10-20
1.45
0.8 -1.1
30-35 |
130-140
10-15
1.45
0.8-1.1
25-30 |
130-140
10-25
1.45
0.6-1.0
25-30 |
| Thermal Properties* |
|
|
|
|
|
Tg, ℃
TIn ℃
T5, ℃
T10, ℃
CTE, ×10 -6/ ℃ |
260-280
>500
>550
>580
30-35 |
280-300
>500
>550
>580
25-28 |
260-280
>500
>550
>580
30-35 |
280-300
>500
>550
>580
20-25 |
240-260
>500
>550
>580
20-25 |
| Electric Properties |
|
|
|
|
|
Dielectric Constant 1 MHz; 0-50% RH
Dissipation factor1 MHz; 0-50% RH
Dielectric Strength( V/µm)
Volume resistivity (W × cm)
Surface resistivity(W) |
3.2-3.4
2-6 x 10-3
250-350
> 1016
> 1015 |
3.2-3.4
2-6 x 10-3
250-350
> 1016
> 1015 |
3.2-3.4
2-6 x 10-3
250-350
> 1016
> 1015 |
3.2-3.4
2-6 x 10-3
250-350
> 1016
> 1015 |
2.9-3.2
2-4 x 10-3
250-350
> 1016
> 1015 |
* Tg: Glass transition temperature;
Tin :Initial decomposition temperature;
T5: Temperature at 5% weight loss; T10:
Temperature at 10% weight loss |
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