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POME Sci-tech Inc. announced recently the introduction
of new type negative photoimeageable polyimide resins as the
silicon chip passivation layers and stress buffer coatings.
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POME Sci-tech Inc. announced recently the introduction of
high performance Electrically/Thermally Conductive Adhesives,
Liquid Epoxy Underfill and Encapsulants for FC-BGA/CSP applications. |
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POME Sci-tech Inc. announced recently the introduction of
high purity α-BPDA, 3,4-ODA and other new types of fluro-containing
diamine monomers. |
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POME Sci-tech Inc. announced recently the introduction of
ZKPI type low temperature-cureable polyimide coating resins
which could be cured at < 200 ℃, typically at 160-180 ℃. |
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High purity aromatic dianhydrides, including BTDA (3,3',4,4'-benzophenone
tetracarboxylic dianhydride) and BPDA (3,3',4,4'-biphenyltetracarboxylic
dianhydride) are recently commercial available in POME Sci-tech
Inc, BTDA and BPDA are important monomers for preparing polyimide
materials. |
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POME Sci-tech Inc. announced recently the introduction of
polyimide composites for high temperature (>300 ℃) applications,
which is a new family of thermal stable polymer composites
derived from polyimide matrix resin reinforced with chopped
carbon fibers ( or glass fibers, Kevlar fibers) and functional
fillers such as graphite powder or TEFE powder. The composite
shapes and parts could be long term serviced at >300 ℃
with great self-lubricating performance. |
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POME Sci-tech Inc. developed and introduced a series of
polyimide liquid crystal alignment coating resins for TN-LCD,
STN-LCD, TFT-LCD. |
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